English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Hauptwerk
Advanced packaging & the internet of things. The future of our industry. 48th International Symposium on Microelectronics, IMAPS 2015
Information
Publications
Export
Statistics
Options
Title
Advanced packaging & the internet of things. The future of our industry. 48th International Symposium on Microelectronics, IMAPS 2015
Titel Supplements
Orlando, Florida, USA, 26-29 October 2015
Institut
International Microelectronics and Packaging Society -IMAPS-
Verlag
Curran
Verlagsort
Red Hook, NY
Datum
2016
Konferenz
International Symposium on Microelectronics 2015