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Advances in electronic packaging 2003. Vol.1
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Title
Advances in electronic packaging 2003. Vol.1
Titel Supplements
Presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6 - 11, 2003, Maui, Hawaii. InterPACK '03, IPACK 03
Institut
American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division
Verlag
ASME
Verlagsort
New York, NY
Datum
2003
Konferenz
International Electronic Packaging Technical Conference and Exhibition 2002