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EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
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Title
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Titel Supplements
20 - 23 April 2008, Freiburg im Breisgau, Germany
Institut
IEEE Components, Packaging, and Manufacturing Technology Society
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2008
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2007