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3rd International Symposium on Advanced Packaging Materials - Processes, Properties and Interfaces 1997. Proceedings
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Title
3rd International Symposium on Advanced Packaging Materials - Processes, Properties and Interfaces 1997. Proceedings
Institut
IEEE Components, Packaging, and Manufacturing Technology Society
International Microelectronics and Packaging Society -IMAPS-
Georgia Institute of Technology, Atlanta
Verlag
IEEE
Verlagsort
New York
Datum
1997
Konferenz
International Symposium on Advanced Packaging Materials 1997