ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2017. Proceedings
Titel Supplements
Presented at ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, August 29-September 1, 2017, San Francisco, California, USA
Institut
American Society of Mechanical Engineers -ASME-
American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division