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11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference, ASIP 2014
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Title
11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference, ASIP 2014
Titel Supplements
The Technology and Market Landscape for Device and Systems Integration and Interconnect; December 10-12, 2014, Burlingame, California
Verlagsort
Burlingame/Calif.
Datum
2014
Konferenz
3D Architectures for Semiconductor Integration and Packaging Conference (ASIP) 2014