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THERMINIC 2009, 15th International Workshop on Thermal Investigations of ICs and Systems
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Title
THERMINIC 2009, 15th International Workshop on Thermal Investigations of ICs and Systems
Titel Supplements
Leuven, Belgium, 7 - 9 October 2009
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Circuits Multi-Projets -CMP-, Grenoble
IEEE Components, Packaging, and Manufacturing Technology Society
Verlag
IEEE
Verlagsort
New York, NY
Datum
2010
Konferenz
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2009