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International Conference on Electronics Packaging, ICEP 2016
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Title
International Conference on Electronics Packaging, ICEP 2016
Titel Supplements
April 20-22, 2016, Sapporo, Japan
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Japan Institute of Electronics Packaging -JIEP-
IEEE Components, Packaging, and Manufacturing Technology Society
International Microelectronics and Packaging Society -IMAPS-
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2016
Konferenz
International Conference on Electronics Packaging (ICEP) 2016