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Developments in wire bonding and alternative interconnection methods for applications in microsystem and multi chip technologies

 
: Lang, K.-D.; Zakel, E.; Reichl, H.

Warsaw University of Technology, Institute of Precision and Biomedical Engineering:
Transactions on the precision and electronic technology. Vol.1: Proceedings of the 1st International Seminar in Precision and Electronic Technology 1993
Warsaw, 1993
International Seminar in Precision and Electronic Technology (INSEL) <1, 1993, Warsaw>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/PX-9664.html