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The Development of a Top-Bottom-BGA (TB-BGA)


Reichl, H.; Obermeier, E. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '98
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2421-9
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <12, 1998, Potsdam>
Fraunhofer IPA ()
Fraunhofer IZM ()
Bauelement; BGA; CSP; gedruckte Schaltung; Keramik; Schnittstelle; TB-BGA

A "Top Bottom Ball Grid Array" (TB-GBA) is described, that takes advantage of existing BGA and CSP techniques, to create a new package for SCMs, MCMs, sensors and actuators. By using a pin-compatible BGA configuration at the bottom and the top of the carrier, a 3D stack assembly of several TB-BGAs is possible. As demonstrators ceramic TB-BGAs are actually developed as single chip modules (SCMs) and multichip modules (MCMs). They will be mounted as intelligent sensors bus interfaces in convetional sensor casings. A full operating 16-bit-processor-unit including microcontroller, SRAM, EEPROM, CAN bus interface, oscillator and SMD components will require a volume of only 1.2 cmü.