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The development of a modular 32 Bit microcontroller MCM in top bottom BGA (TB-BGA) technique

: Leutenbauer, R.; Amiri Jam, K.; Reichl, H.

Welterlen, J.D. ; International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Microelectronics 1998. Proceedings : November 1 - 4, 1998, San Diego Convention Center, San Diego, California
Reston, Va.: IMAPS, 1998 (SPIE Proceedings Series 3582)
ISBN: 0-930815-52-1
International Symposium on Microelectronics <1998, San Diego/Calif.>
Fraunhofer IZM ()
ball grid arrays; bending; ceramic packaging; integrated circuit packaging; integrated circuit reliability; integrated memory circuits; microcontrollers; multichip module

A modular 32-bit microcontroller MCM is described, that takes advantage of the TB-BGA technique developed by IZM. By using a pin compatible BGA configuration at the bottom and the top of the MCM carrier, a 3D stack assembly of several TB-BGAs is possible. The existing ceramic TB-BGAs form a 16 bit controller family, consisting of microcontroller, memory and interface modules. A full operating 16 bit processor unit requires a volume of only 1.2 cm3. Considering thermomechanical reliability, the compact stack assembly reduces bending loads and shear forces by using suitable materials. The solder ball area configuration ensures a good thermal conductivity.