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The development of a FC-BGA

 
: Simon, J.; Chmiel, G.; Leutenbauer, R.; Reichl, H.

Semiconductor Technology Center, Inc.:
International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1995. Proceedings : combines the Second International Flip Chip and Ball Grid Array Symposium with the Seventh International TAB and Advanced Packaging Symposium
Neffs, Pa.: Semiconductor Technology Center, 1995
S.54-64
International TAB and Advanced Packaging Symposium (ITAP) <7, 1995, San Jose/Calif.>
International Flip Chip, Ball Grid Array, TAB, and Advanced Packaging Symposium <2, 1995, San Jose/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
Reduction of volume and size is a current issue in electronic packaging, which can be achieved by the use of bare dice. COB (Chip on Board) and flip chip are common bare die assembly technologies for this purpose. But COB is related to the KGD question and flip chip requires bumped dice. Hence a Chip Size Package (CSP) can overcome the problem. Therefore the FC-BGA was developed to demonstrate the advantages of a CSP. The FC-BGA is a wafer level technology.

: http://publica.fraunhofer.de/dokumente/PX-9562.html