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The Design methodology of 3D-HDI


Reichl, H.; Obermeier, E. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '98
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2421-9
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <6, 1998, Potsdam>
Fraunhofer IZM ()

Several new technologies for the production of 3D-packages in HDI (High Density Integration) are discussed in this paper. These low cost 3D-packages for MCMs, sensors, actuators and portable devices are developed by IZM in Berlin. One of these packaging technologies is the 3D-BGA. In this concept multilayer circuits were fabricated on several FR4 cores. Afterwards the dies are attached by flip chip process, the flexible carriers were folded like an accordion to a 3D-MCM. The MCM has a BGA configuration at the bottom and a SMD connector at the top, allowing the interconnection of 3D-MCM with other MCMs or mainboards. As demonstrator, a full operating 16-bit processor-unit including microcontroller, SRAM, EEPROM, CAN bus interface, oscillator and SMD components will be developed. The volume of this 3D-HDI-MCM is only 1.25 cm3. Other 3D-MCMs (StackPacks, 3D-BGAs) will be explained as well.