Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Design and Application of Modular Microsystems
| Reichl, H.; Obermeier, E. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '98
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2421-9
S.589-594 |
| International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <12, 1998, Potsdam> |
|
| Englisch |
| Konferenzbeitrag |
| Fraunhofer IPA ()
Fraunhofer IZM () |
| Fertigung; Konstruktion; Mikrosystem; Modulbauweise |
Abstract
A highly flexible modular design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed. Packaging and assembly of micromodules are discussed. It is shown that, under the given conditions, a vertical assembly concept using already packaged micromodules is the most appropriate choice. Furthermore, a design concept for modular microsystems is presented, which allows users not familiar with microstructuring technologies the design of application-adapted microsystems. The feasibility of the modular approach is demonstrated by the realization of a smart modular pressure sensor combining stackable micromodules, interfaces, plug, and enclosure.