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Design and Application of Modular Microsystems

 
: Schünemann, M.; Bauer, G.; Schäfer, W.; Leutenbauer, R.; Grosser, V.; Zoeppig, V.

Reichl, H.; Obermeier, E. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '98
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2421-9
S.589-594
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <12, 1998, Potsdam>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
Fraunhofer IZM ()
Fertigung; Konstruktion; Mikrosystem; Modulbauweise

Abstract
A highly flexible modular design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed. Packaging and assembly of micromodules are discussed. It is shown that, under the given conditions, a vertical assembly concept using already packaged micromodules is the most appropriate choice. Furthermore, a design concept for modular microsystems is presented, which allows users not familiar with microstructuring technologies the design of application-adapted microsystems. The feasibility of the modular approach is demonstrated by the realization of a smart modular pressure sensor combining stackable micromodules, interfaces, plug, and enclosure.

: http://publica.fraunhofer.de/dokumente/PX-9273.html