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Deformation analysis on flip chip solder interconnects by MicroDAC

 

Mahidhara, R.K. ; ASM International, Flow and Fracture Committee; The Minerals, Metals and Materials Society -TMS-, Warrendale/Pa.:
Design and reliability of solders and solder interconnections 1997. Proceedings of a symposium held during the TMS Annual Meeting
Warrendals,Pa.: Minerals, Metals and Materials Society, 1997
ISBN: 0-87339-354-6
S.429-438
Solder Joint Symposium <1997, Orlando/Fla.>
TMS Annual Meeting <1997, Orlando/Fla.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/PX-9107.html