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Debonding of adhesively joined electronic circuits to the purpose of recycling.

Entstücken von klebtechnisch gefertigten Leiterplatten zum Zwecke des Recyclings
 
: Hartwig, A.; Hennemann, O.-D.

International Seminar on Recent Achievements in Conductive Adhesive Joining Technology in Electronic Manufacture. Proceedings
1994
International Seminar on Recent Achievements in Conductive Adhesive Joining Technology in Electronic Manufacture <1993, Göteborg>
Englisch
Konferenzbeitrag
Fraunhofer IFAM ()
debonding; electrically conductive adhesive; elektrisch leitender Klebstoff; Entfügen; Entstücken; Leitklebstoff; Lotersatz; recycling; repair; Reparatur; solder replacement

Abstract
The need of solder replacement is discussed from the ecological point of view. Electrically conductive adhesives are at the moment the best alternative. In the article is shown, that the methods to debond soldered electronic circuits for the purpose of recycling or repair are usable for adhesively bonded circuits, too.

: http://publica.fraunhofer.de/dokumente/PX-9026.html