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Comparison of soldered and adhesively bonded joints from the ecological point of view

Vergleich gelöteter und geklebter Platinen aus ökologischer Sicht
 
: Hartwig, A.; Lüschen, R.; Kriebel, F.; Seidowski, T.; Hennemann, O.-D.

VDI/VDE Technologiezentrum Informationstechnik:
Adhesives in Electronics '94. First International Conference on Adhesive Joining Technology in Electronics Manufacturing
Teltow: VDI/VDE-Technologiezentrum Informationstechnik, 1994
International Conference on Adhesive Joining Technology in Electronics Manufacturing <1, 1994, Berlin>
Englisch
Konferenzbeitrag
Fraunhofer IFAM ()
conductive adhesive; debonding; Entfügen; Leitklebstoff; recycling; repair; Reparatur; zin lead solder; Zinn-Blei-Lot

Abstract
Conductive adhesive bonding is one of the possible alternatives to soldering which need to be replaced in various fields of application by ecological and technological reasons. A comparison of the two joining methods will be presented from the ecological point of view.For the evaluation of the ecological compatibility of a product the whole lifespan must be taken into consideration.Therefore, production, use of the product, repairability and recycability are discussed.Soldered electronics are repairable.It will be shown that this is also the case for adhesively joined electronics.The possibilities to debond the joints for the purpose of repair or recycling will be pointed out.Medical aspects are to be considered in view of the evaporation and decomposition of soldering flux as well as the irritating properties of adhesives.For epoxy resins it will be shown, which are the irritating components and how to avoid contact them.Finally the influence of electrically conductive adhesives and t in/lead-solder on nature will be shown when they are disposed on a deposition area or a refuse incineration plant.

: http://publica.fraunhofer.de/dokumente/PX-8219.html