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1988
Conference Paper
Titel
Chemical metallization of ceramic substrates - an alternative to thick and thin-film technology
Alternative
Chemische Metallisierung von Keramiksubstraten - eine Alternative zur Dickschicht- und Dünnfilmtechnik
Abstract
In future mounting and interconnection techniques, fine line structures with high aspect ratios and good conductivity will be needed. The chemical metallization of ceramic substrates with copper of sufficient adhesive strength meets these demands. An even coating of different surface forms (plated through holes) of a maximum film thickness of bigger 30 mym is possible by the deposition from hydrous solutions. All familiar processes (subtractive, additive, semiadditive) can be applied for patterning. The application for high frequency could be proved with the help of a lambda/2 resonator (up to 5 GHz) and a band pass filter (3 to 6 GHz). Important mechanical properties, such as adhesive strength, soldering and bonding characteristics, point towards equal if not better quality compared to thick film technique. (IFT)