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Title
Verfahren und Vorrichtung zum Abtragen von Schichten von einer Oberflaeche
Date Issued
2002
Author(s)
Patent No
2001-10113494
Abstract
Die Erfindung betrifft eine Vorrichtung zum Abtragen von Schichten von einer Oberflaeche mit einem Lichtleiter, dessen Kerndurchmesser maximal 400 mm betraegt sowie die Verwendung der Vorrichtung. Die Erfindung betrifft ausserdem ein entsprechendes Verfahren. Dazu ist eine Laserstrahlquelle vorgesehen, die einen Strahl mit niedriger Divergenz erzeugt. Die Vorrichtung weist einen Vorteil auf, dass Schichten mit einem hohen Arbeitsabstand zwischen Oberflaeche und einem Bearbeitungskopf moeglich ist.
DE 10113494 A UPAB: 20021120 NOVELTY - The device has a processing distance of at least 100 mm., a laser source with a mean and pulse output powers of at least 150 Watts and 50 kW. It has at least one arrangement for coupling radiation into a light conductor associated with a portable processing head and at least one focusing arrangement. DETAILED DESCRIPTION - The source output divergence is dimensioned so the radiation can be coupled into a light conductor whose core diameter is not greater than 400 microns. The device has a processing distance of at least 100 mm., a laser light source (1) with a mean output power of at least 150 Watts and a pulse power of at least 50 kW, at least one arrangement (3) for coupling radiation into a light conductor (2) associated with a portable processing head (6) and at least one focusing arrangement. The divergence of the radiation at the output of the source is dimensioned so that the radiation can be coupled into a light conductor whose core diameter is not greater than 400 microns. AN INDEPENDENT CLAIM is also included for the following:- a method of laser assisted removal of layers from a surface. USE - For removing layers from surface, for removing coatings from high voltage masts (claimed). ADVANTAGE - Overcomes certain disadvantages of conventional arrangements, and enables laser radiation emanating from a light conductor at medium power of at least 150 Watts and from a pulse line at at least 50 kW to be focused using a portable processing head so that the burn point is more than 100 mm. from the processing head.
Language
de
Institute
Patenprio
DE 2001-10113494 A: 20010320