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Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis

EUROTHERM Seminar No.45.

1995, 10 S.
Thermal Management of Electronic Systems <1995, Leuven>
Englisch
Tagungsband
Fraunhofer IZM ()
coupling; deformation measurement technique; electronic packaging; FEM; mechanical analysis; mesh refinement; nonlinear material representation; thermal analysis; thermal stress; thermal test cycle

: http://publica.fraunhofer.de/dokumente/PX-57913.html