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Automated assembly of microcomponents support by a 3D-inspection system

: Eberhardt, R.; Scheller, T.; Menzel, E.-M.; Döring, M.; Lenhardt, K.; Kopp, H.

Reichl, H.; Obermeier, E. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '98
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2421-9
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <6, 1998, Potsdam>
Fraunhofer IOF ()
microassembly; microcomponent; microoptics

At the present time most conventional microassembly systems are viewed as not being able to fulfil the important requirements of microassembly tasks. Especially achieving a positioning accuracy of less than five mu m has been only possible. Assembly systems qualified for automated sequence of feeding, handling, inspection and joining. One possibility to increase the accuracy of an assembly system is the integration of an inspection system which detects actual joining positions and gives feedback information for correcting the actual position during the adhesive bonding process. Corrections are best achieved using small steps with high resolution.