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Zuverlässigkeit von Leitklebverbindungen bei der Oberflächenmontage

 
: Hennemann, O.-D.

SMD-Magazin 1 (1990), S.61-68
Deutsch
Zeitschriftenaufsatz
Fraunhofer IFAM ()
Klebstoff; Langzeitbeständigkeit; Leitfähigkeit; Oberflächenmontage; Silberdiffusion; Silberflake

Abstract
In the associated partners' research project "Adhesive bonding technologies in the electronics" the companies SEL and Degussa together with the Fraunhofer-Institut für Angewandte Materialforschung (IFAM), Bremen, have tested an alternative joining technology to soldering, the conductive adhesive bonding of surface mountable components with conductor tracks of printed circuit boards and/or thick films connections and transferred them into the manufacturing process. It was the main task of the IFAM to describe the ageing phenomenons and to give a system to this if possible. To manage this it was necessary to elaborate a suitable analytic and to adapt it to the changing requirements during the project. The elaborated statements are written down in this article. They were applied when formulating optimized adhesive products.

: http://publica.fraunhofer.de/dokumente/PX-42621.html