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Title
Vorrichtung zur Waermeableitung in einem Chip mittels einer als Peltier-Element ausgebildeten Kuehlstelle
Date Issued
1994
Author(s)
Lang, W.
Drost, A.
Patent No
1991-4104327
Abstract
The present invention relates to a device for heat dissipation in a chip by means of a cooling spot (Peltier cooler) in the form of a Peltier element, by which one or more circuit components and/or sensors can be integrated on the chip together with the Peltier cooler. A thin Si film (Si membrane) covering a recess is arranged on a Si wafer provided with a recess. An insulation film and, above it, a metal film are arranged on the Si membrane; the metal film and the Si membrane are conductively connected via a contact hole in the insulation film. In a preferred version, the Peltier cooler together with the circuit elements and/or sensors arranged on the Si membrane are separated from the Si wafer by isotropic etching of the Si membrane except for at least a web-like connection. Thus, good thermal insulation is attained between the Peltier cooler, the circuit elements and/or sensors to be cooled, and the substrate. The device is produced in a cost-effective manner using known semiconduct or processes, microstructuring and thin-film technology.
Language
de
Patenprio
DE 1991-4104327 A: 19910213