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Vorrichtung zum Kuehlen von Halbleiterbauelementen und ihre Verwendung

Semiconductor device cooling device for laser diode.
 
: Miermann, L.; Ebert, T.; Pochner, K.

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Frontpage ()

DE 1997-19744281 A: 19971007
DE 1997-19744281 A: 19971007
DE 19744281 A1: 19990602
H01S0003
Deutsch
Patent, Elektronische Publikation
Fraunhofer ILT ()

Abstract
NOVELTY - The device has coolant-filled capillary structures (15) which have a high capillary pressure through suitable adjustment of permeability, cross-section surface area, and effective pore diameter. Additional channels (13) are provided, having a larger cross-section than the effective pore diameter in the capillary structure, so that the channels have a lower flow resistance than the capillary structure. DETAILED DESCRIPTION - The device consists of a casing, and at least one coolant-filled capillary structure (15) arranged in the casing, which do not fill out the casing completely, so that one or several cavities (17) remain. The capillary structure has a high capillary pressure through suitable adjustment of permeability, cross-section surface area, and effective pore diameter. Additional channels (13) are provided within the casing, having a larger cross-section than the effective pore diameter in the capillary structure, so that the channels have a lower flow resistance than the capillary structure. The channels lie preferably parallel to the flow direction of the coolant. USE - Especially for high-power laser diode. ADVANTAGE - Provides improved cooling. DESCRIPTION OF DRAWING(S) - The figure shows an arrangement according to the invention. additional channels 13 capillary structures 15 cavities 17

: http://publica.fraunhofer.de/dokumente/PX-40722.html