Verfahren zur Materialbearbeitung mit Diodenstrahlung

The invention relates to a process for machining materials using diode radiation, in particular laser diode radiation. In order to achieve a matching of the beam profile to the machining process, the process is performed in such a way that the radiation emitted by numerous diodes is directed at the machining area of the workpiece using a predefined beam profile, and that a change in intensity distribution in the beam profile takes place by controlling the diode output power.