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Verfahren zur Materialbearbeitung mit Diodenstrahlung

Process for machining materials using diode radiation
: Beyer, E.; Wissenbach, K.; Krause, V.

Frontpage ()

DE 1993-4316829 A: 19930519
DE 1993-4316829 A: 19930519
DE 4316829 A: 19930519
EP 1994-911123 A: 19940308
WO 1994-EP706 W: 19940308
DE 4316829 A1: 19941124
EP 700325 B1: 19970813
Patent, Elektronische Publikation
Fraunhofer ILT ()

The invention relates to a process for machining materials using diode radiation, in particular laser diode radiation. In order to achieve a matching of the beam profile to the machining process, the process is performed in such a way that the radiation emitted by numerous diodes is directed at the machining area of the workpiece using a predefined beam profile, and that a change in intensity distribution in the beam profile takes place by controlling the diode output power.