Verfahren zur Verbindung von Kontaktflächen eines elektronischen Bauelements und eines Substrats
Date Issued
1999
Author(s)
Weiss, S.
Zakel, E.
Patent No
1995-19511898
Abstract
The process is used to bring the contact surfaces (12) of the electronic component (10) into contact with corresponding contact surfaces (14) of a circuit board substrate (11) via intermediate contact metallisations (16,17) formed by soldering or welding. The electronic component and the substrate are pressed together during the application of heat, with insertion of an application layer (18) containing a polyalcohol between the contact surfaces of the electronic component and/or the substrate and the connecting material (15) for the contact metallisation. ADVANTAGE - Eliminates need for cleaning procedure.