Verfahren zur Beschichtung von sub-Mikrometerstrukturen und seine Anwendung
Date Issued
1996
Author(s)
Weber, A.
Jung, T.
Patent No
1995-19513918
Abstract
Submicrometer structures are coated by cathodic sputtering or vaporising a target material in a high or low vacuum chamber with a carrier inert gas going past the target, collecting the vapour material and transporting it perpendicularly onto the surface to be coated. USE - Coating highly integrated circuits. ADVANTAGE - The bottom and sides of small surface depressions are coated at high speed without the depressions becoming fully filled in.