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Title
Verfahren zur Aufbereitung der Schnittflaechen eines Bauteils fuer schichtweise arbeitende Fertigungsprozesse
Date Issued
1999
Author(s)
Krause, F.
Ulbrich, A.
Ciesla, M.
Wirtz, H.
Patent No
1997-19727934
Abstract
The component surface preparation method has the individual layers of the component divided into segments, with the local layer thickness for each of these segments determined, in dependence on the layer geometry. The component may be divided into segments via an adaptive slicing technique, using a 3- dimensional model of the required component geometry. The layer thickness of each segment may be determined from the localised curvature at each layer and the accuracy requirement. USE - For layered manufacturing technique for solid freeform fabrication, e.g. for laminated object manufacture, with computer-aided design. ADVANTAGE - Reduced manufacturing time.
Language
de
Patenprio
DE 1997-19727934 A: 19970701