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Title
Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchfuehrung des Verfahrens
Date Issued
1999
Author(s)
Weisener, T.
Voegele, G.
Bark, C.
Patent No
1994-4446489
Abstract
The description refers to a process for the manipulation of microcomponents by which a gripper picks a component from a storage location or similar, whereby adhesives are applied between the gripper surface and a component to be manipulated, and said gripper places said component at its destination. The gripper is positioned horizontally above the component to be manipulated and adhesive is fed to the gripper surface. The gripper and component are then moved towards each other until the liquid completely wets the surface between them. The amount of fluid between the gripper surface and the component can be reduced until the optimum adhesion force is reached. The gripper and the component is then moved to an assembly station and the aligned components, possibly after suitable fixing, is released. At the end of this joining process, the gripper is released from the components and returned to its starting position.
Language
de
Patenprio
DE 1994-4446489 A: 19941223