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Title
Verfahren zum gleichzeitigen mechanischen und elektrischen Verbinden von integrierten Schaltungen mit beliebigen Substratmaterialien
Date Issued
2001
Author(s)
Feil, M.
Patent No
1996-19630593
Abstract
This new method bonds and connects an integrated circuit (10) to a substrate (26), directly. An anisotropically-conducting adhesive (14, 14a) is applied to the surface of either the integrated circuit, or the substrate (26). Distributed over both mating surfaces, there are corresponding, projecting patterns (28), designed to make connection. The parts are joined with the patterns orientated accordingly. The adhesive bonds them mechanically, at the same time completing the electrical connections. Also claimed are electronic circuit arrangements made as above. USE - To bond an integrated circuit electrically and mechanically to a substrate with circuit connections, using an adhesive. ADVANTAGE - This method facilitates direct and efficient mounting of an integrated circuit chip, unhoused, onto a substrate, which is e.g. a circuit board or film. It avoids complications of flip-chip assembly and wire bonding. Strikingly, the outstanding miniaturisation achieved is not subject to differenti al thermal expansion problems at the points of connection. This increases reliability. Inductance of the connection is negligible, good news for highest frequency applications (exceeding the low GHz region). When completed, the adhesive connections have preferential electrical conductivity perpendicular to the facing contact surfaces, for ideal connection, surrounded by comparatively insulating material. Surface insulation may be overlaid in addition, on the conducive regions before bonding. Another striking feature is distribution of the contact pads over the entire surface; normally these occupy only the edges. This improves electrical and mechanical connection, as well as boost
Language
de
Patenprio
DE 1996-19630593 A: 19960730