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Verfahren zum Bekeimen und/oder Implantieren und/oder Beschichten und/oder Strukturieren einer Oberflaeche und Lasersputteranlage zur Durchfuehrung des Verfahrens

Laser sputter installation and method for seeding and/or implanting and/or structuring a surface.
: Azdasht, G.; Reichl, H.

Frontpage ()

DE 1997-19748532 A1: 19971103
DE 1997-19756348 A: 19971218
DE 19756348 C1: 19990415
Patent, Elektronische Publikation
Fraunhofer IZM ()

NOVELTY - A laser beam (101) is directed through an optical system (109,102) onto one or more target materials (103) in a nozzle housing (104), in order to evaporate these materials into target material particles. The target material particles thus produced are carried by a flow of a gaseous medium (113) through the opening (115) onto the surface (119,106) to be treated. USE - For production of contact layers on electronic component, for example. ADVANTAGE - Arbitrarily shaped, very small metallization structures of high accuracy and homogeneity can be produced by means of low-cost, simple equipment. DESCRIPTION OF DRAWING(S) - The drawing shows the proposed installation. Laser beam 101 Optical system 102, 109 Target materials 103 Nozzle housing 104 Surface to be treated 106, 119 Gaseous medium 113 Nozzle opening 115