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VERFAHREN UND VORRICHTUNG ZUR OBERFLAECHENBEHANDLUNG VON SUBSTRATEN

Method for surface treating of substrates.
 
: Jung, T.; Klages, C.

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Frontpage ()

DE 1997-19744060 A: 19971006
DE 1997-19744060 A: 19971006
EP 1998-947538 AW: 19980918
WO 1998-EP5982 A: 19980918
DE 19744060 C2: 19990812
EP 1019945 B1: 20050406
H01J0037
Deutsch
Patent, Elektronische Publikation
Fraunhofer IST ()

Abstract
NOVELTY - the method involves the use of a gas in the vicinity of an electrical discharge (2). The discharge region is limited by the substrate (1) surface (7) on at least two essentially opposite sides. One or more continuously conveyed substrates are fed at least partially to the discharge region DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an arrangement for carrying out the method USE - for surface treating of electrically conducting or electrically conductively coated substrates ADVANTAGE - ensures high plasma densities and conc. of the plasma densities near the surface being treated whilst simultaneously reducing parasitic deposits.

: http://publica.fraunhofer.de/dokumente/PX-38709.html