Method for surface treating of substrates.

Abstract
NOVELTY - the method involves the use of a gas in the vicinity of an electrical discharge (2). The discharge region is limited by the substrate (1) surface (7) on at least two essentially opposite sides. One or more continuously conveyed substrates are fed at least partially to the discharge region DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an arrangement for carrying out the method USE - for surface treating of electrically conducting or electrically conductively coated substrates ADVANTAGE - ensures high plasma densities and conc. of the plasma densities near the surface being treated whilst simultaneously reducing parasitic deposits.