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Verfahren und Vorrichtung zum Ueberpruefen der Qualitaet von Drahtverbindungen elektrischer Bauteile

Method to check quality of wire bonds in integrated circuit production.
: Oberdorfer, B.

Frontpage ()

DE 1997-19754871 A: 19971210
DE 1997-19754871 A: 19971210
DE 19754871 C2: 20031218
Patent, Elektronische Publikation
Fraunhofer IPA ()

NOVELTY - At least one wire (4) is detected either by a camera and a defined line pattern, or by at least two cameras. The individual camera and the line pattern or both cameras are calibrated with respect to their spatial position. Arbitrary or predetermined points are identified and the location of these points are determined by triangulation in a computer system. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is given for a device to carry out the method. USE - For either checking the connection wires individually or simultaneously on microchips that has been fully wired, or each wire individually immediately after wiring. ADVANTAGE - Method is simple, quick and reliable.