Amine-curing single-component epoxy resin adhesive compound on an epoxide base having the formula (I) formula 1 where X is a bivalent organic residue CRR', Z is a bivalent organic residue which can contain aromatic groups and heteroatoms, R and R' are hydrogen or an alkyl residue, where R and R' can be identical or different and n is 0 or 1.