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Thick Film Alloy Resistor System on AIN

 
: Kretzschmar, C.; Otschik, P.

Gens, W. ; TU Ilmenau:
43. Internationales Wissenschaftliches Kolloquium 1998. Band 2: Vortragsreihen Mikroelektronische Schaltungen und Systeme, Festkörperelektronik und Sensoren, innovative Werkstoffe und Oberflächentechnik
Ilmenau: TU, 1998
S.92-97
Internationales Wissenschaftliches Kolloquium <43, 1998, Ilmenau>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
AgPd-Alloy; AlN; thick film paste

Abstract
Because of the high thermal conductivity AlN is of interest to substrate material for high power application. AgPd alloys can be used with "a non-reducible" glass for thick film resistors on AlN. These resistors are complex non-equilibrium systems. The paper describes correlations between the paste composition, the firing conditions, the phase content and the electrical properties of the fired films. The composition of the AgPd alloy and the PdO content mainly influence the TCR`s, the glass content the sheet resistance. With the investigated system it is possible to realize pastes with sheet resistance between 100 mOhm/sq and 1 Ohm/sq and with a cold- and hot-TCR in the range +/- 50 ppm/K for AlN.

: http://publica.fraunhofer.de/dokumente/PX-36491.html