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Spritzgegossene Aluminiumnitridkeramik für Anwendungen in der Hochleistungselektronik

 
: Himpel, G.; Lenk, R.

Deutsche Keramische Gesellschaft e.V. -DKG-:
Keramische Prozesstechnik - Wege zu einer flexibleren Keramik-Fertigung. Jahrestagung 1998 der Deutschen Keramischen Gesellschaft
Köln: DKG, 1998
S.73-75
Deutsche Keramische Gesellschaft (Jahrestagung) <1998, Erlangen>
Deutsch
Konferenzbeitrag
Fraunhofer IKTS ()
Aluminiumnitrid-Kühlelement,; Aluminiumnitridkeramik; aluminum nitride ceramics; catalytic binder removal; cooling element; endkonturgenaue Formgebung; injection moulding; katalytische Binderfreisetzung; near-net-shape forming method; Spritzguss; thermal conductivity; Wärmeleitfähigkeit

Abstract
Basing on their favorable attributes aluminum nitride ceramics are able to replace alumina which is the dominant insulator-material in different fields of electronics so far. The advantages of aluminum nitride are: Very good thermal conductivity in combination with high electrical resistance and low coefficient of thermal expansion at high electrical breakdown strength, low dielectric loss at high frequencies and good resistance to thermal shock including a low specific weight. The possibility of an efficient manufacture of parts with a broad variety of shapes is one of the most importent preconditions for the development of new application fields. By using a near-net-shape forming method a lot of costs for the finishing treatment of ceramics can be saved. With the development of a process for the manufacture of a cooling elements by injection moulding of aluminum nitride in combination with the catalytic binder removal an effective technology of the production of parts with wall thick nesses of up to 10mm made of this ceramic material is presented.

: http://publica.fraunhofer.de/dokumente/PX-34528.html