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1993
Journal Article
Titel
Speckle interferometry for analysing anisotropic thermal expansions - application to specimens and components
Alternative
Anisotroper Wärmedehnung von Proben und Bauteilen - ein Anwendungsfall für optische Meßtechnik
Abstract
The paper describes a non-destructive, optical technique, digital speckle pattern interferometry (DSPI), that has been especially advanced for strain analysis and has proved well-suited for thermal deformation measurement. A first part deals with the principle of operation and its implementation for materials testing. A variety of applications is demonstrated. Fibre-reinforced composites of metal matrix (MMC) as well as nonmetal matrix (NMMC) type could be characterized by DSPI with respect to their thermal expansion dependent upon direction and temperature. Complete series of measurements could be performed quickly and without any restriction to the specimen shape. Just as well, engineering components including composite structures have been subject of investigation. Beside quantitative results real-time observation provides basic information for materials understanding.