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Residual stress states of graded CuW materials

: Bokuchava, G.; Schreiber, J.; Shamsutdinov, N.; Stalder, M.

Kaysser W.A.:
Functionally Graded Materials 1998. Proceedings of the 5th International Symposium on Functionally Graded Materials : Held in New Town Hall, Dresden, Germany, October 26 - 29, 1998
Uetikon-Zürich: Trans Tech Publications, 1999 (Materials science forum 308/311)
ISBN: 0-87849-833-8
International Symposium on Functionally Graded Materials <5, 1998, Dresden>
Fraunhofer IZFP ()
Cu-W Gradient Materials; neutron diffraction; plastic deformation; residual stress

The residual stress states of differnt W-Cu gradient smples were analysed by neutron diffraction. It was found that plastic deformation can strongly modify the thermally induced stresses. The thermal expansion coefficients of the individual phases within the composite were determined indicating that the two sublattices influence each other. Uniaxial compressional loading carried out to investigate the mechanical properties of the composites imply the the yield strength for copper increases to up to 300 MPa in a 20Cu/80W vol. per cent sample. Finally, the influence of the manufacturing process on the stress state was checked by repeating the stress analysis with one of the samples after annealing.