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Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substrates
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1995
Conference Paper
Titel
Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substrates
Author(s)
Klöser, J.
Zakel, E.
Bechtold, F.
Reichl, H.
Hauptwerk
ECTC '95. 45th IEEE electronic components and technology conference. Proceedings
Konferenz
IEEE Electronic Components and Technology Conference 1995
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM