Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Porous metal powders for conductive adhesives

 
: Günther, B.; Schäfer, H.

2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1996. Proceedings
Stockholm, 1996
S.55-59
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing <2, 1996, Stockholm>
Englisch
Konferenzbeitrag
Fraunhofer IFAM ()
Klebtechnik; Leitfähigkeit; Metallpulver; Nanopulver; Verbindungstechnik

Abstract
Electrically conductive adhesives for chip-on-board bonding may be realized by using epoxy resins filled with porous silver powders - a concept that is similar to using carbon soot, but instead at an increased conductivity level. Such powders have been produced by a gas phase method, whereby silver vapour condenses within an inert gas atmosphere. Different sieving methods have been applied, the airjet method leading to the best results with respect to powder quality. The powders consist of sintered networks of ultrafine particles in the size range 50 nm to 200 nm. The average diameter of these aggregates could be adjusted down to some mu m. The assieved powders are characterized by low level of impurity content (<0.25wt per cent oxygen, alkali-free), an internal porosity of about 60 ... 80 per cent, a good ability for resin infiltration and excellent mechanical properties of adhesive bonds made thereof.

: http://publica.fraunhofer.de/dokumente/PX-28951.html