Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Pastes for high temperature resistors in power hybrids and microwave circuits

 
: Otschik, P.; Kretzschmar, C.; Reppe, G.; Schaffel, A.

Deutscher Verband für Schweißtechnik e.V. -DVS-, Düsseldorf:
EuPac '98. 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics. Lectures and poster
Düsseldorf: DVS-Verlag, 1998 (DVS-Berichte 191)
ISBN: 3-87155-497-9
S.147-150
European Conference on Electronic Packaging Technology (EuPac) <3, 1998, Nürnberg>
International Conference on Interconnection Technology in Electronics <9, 1998, Nürnberg>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
AlN; microwave; resistor; thick film

Abstract
AlN substrates with high stable thick film resistors are a suitable material combination for attenuators and terminations in microwave circuits for high frequency applications. The degradation of the FK 9200 resistors was investigated. Two competing interactions in the unencapsulated resistors were observed what correlates with a special influence of the atmosphere. By using of a new glass and reducing of the amount of modifiers a resistor system (FK 9600)was developed with high stability up to 200 deg C working temperature.

: http://publica.fraunhofer.de/dokumente/PX-28057.html