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Packaging and interconnection techniques for microsystems

 
: Reichl, H.

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Microwave Theory and Techniques Society:
International Conference on Systems, Man and Cybernetics '93. Proceedings. Vol.4
Piscataway, NJ, USA: IEEE Press, 1993
ISBN: 0-7803-0911-1
International Conference on Systems, Man and Cybernetics (SMC) <1993, Le Touquet>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/PX-27868.html