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Optical microsystems. Packaging strategy by design and modelling

 

Slovak University of Technology -STU-, Faculty of Electrical Engineering and Information Technology, Bratislava:
First Electronic Circuits and Systems Conference 1997. Conference proceedings
Bratislava, 1997
S.151-157
Electronic Circuits and Systems Conference (ECS) <1, 1997, Bratislava>
Englisch
Konferenzbeitrag
Fraunhofer IOF ()
Fraunhofer IZM ()
design; design methodology; optical microsystem; packaging technology; specification

Abstract
A new way to select proper packaging strategies for optical microsystems by means of design and modelling is presented. A specification environment takes into account the hybrid nature of microsystems, i.e. the combination of microoptical, integrated-optical, electrical, mechanical, and packaging components. The optical, electrical, and thermomechanical interactions as well as the system function itself is delineated by a design environment.

: http://publica.fraunhofer.de/dokumente/PX-27341.html