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3-D project and current statics of 3-D technology in West Germany

 
: Seegebrecht, P.

Extended Abstracts of the 5th International Workshop on Future Electron Devices
1988
S.19-26
Three Dimensional Integration <1988, Miyagi-Zao>
Englisch
Konferenzbeitrag
Fraunhofer IFT; 2000 dem IZM eingegliedert
Molekularstrahlepitaxie; Prozeßsimulation; Schaltung(dreidimensional integriert); SOI-Technik

Abstract
Due to their considerable importance for the future course of microelectronics and system technologies, three-dimensional multi-functional integrated circuits shall be developed within the framework of the 3-D Project. To this end leading scientists engaged in R and D from various German enterprises in the semiconductor industry and scientific institutes participate in this joint project in order to acquire the necessary know-how and to carry out the respective tasks in research and development in close cooperation. This paper provides information on the targets and the structure of the 3-D Project. Furthermore, it comprises a survey of the tasks planned as well as of the results accomplished up to the present. (IFT)

: http://publica.fraunhofer.de/dokumente/PX-2728.html