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O/e-MCM packaging with new, patternable dielectric and optical materials
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1998
Conference Paper
Titel
O/e-MCM packaging with new, patternable dielectric and optical materials
Author(s)
Robertsson, M.E.
Hagel, O.-J.
Gustafson, G.
Dabek, A.
Popall, M.
Cergel, L.
Wennekers, P.
Kiely, P.
Lebby, M.
Lindahl, T.
Hauptwerk
48th Electronic Components and Technology Conference 1998. Proceedings
Konferenz
Electronic Components and Technology Conference (ECTC) 1998
DOI
10.1109/ECTC.1998.678929
Language
English
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Fraunhofer-Institut für Silicatforschung ISC