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O/e-MCM packaging with new, patternable dielectric and optical materials

 

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Electronic Industries Association -EIA-; IEEE Components, Packaging, and Manufacturing Technology Society:
48th Electronic Components and Technology Conference 1998. Proceedings
Piscataway/N.J.: IEEE Order Department, 1998
ISBN: 0-7803-4526-6
ISBN: 0-7803-4527-4
ISBN: 0-7803-4528-2
ISBN: 0-7803-4529-0
S.1413
Electronic Components and Technology Conference (ECTC) <48, 1998, Seattle/Wash.>
Englisch
Konferenzbeitrag
Fraunhofer ISC ()

: http://publica.fraunhofer.de/dokumente/PX-26770.html