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New system for fast submicron optical direct writing



Microelectronic engineering 30 (1996), S.123-127
ISSN: 0167-9317
International Conference on Micro- and Nano-Engineering <21, 1995, Aix-en Provence>
Fraunhofer IMS, Außenstelle Dresden ( IPMS) ()
Bilderzeugung; DUV-Lithographie; Elastomer; Excimer-Laser; Licht; Mikrolithographie; modulation

We report on a new system for submicron lithography by fast laser direct writing, where a programmable phase modulating spatial light modulator (SLM) is imaged onto the wafer using flash on the fly exposure with an excimer laser light source.A SLM with 512x464 pixels has been developed and fabricated using a CMOS active matrix and a reflective, deformable viscoelastic layer on top. Using this light modulator for image generation a demonstrator exposure tool for 0.6 mu m minimum feature size has been set up and tested including all the components necessary for the exposure of a complete lithographic layer from CAD layout data. the demonstrator is shown to give good quality 0.6 mu m photoresist pattern at a throughput of roughly one 4-inch-wafer per hour. Based on the demonstrator results we are designing and setting up a prototype of a production tool with an increased throughput of up to nine 6-inch-wafer per hour including an automatic alignment system and an automatic wafer handler.