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A new chip packaging method using windowless Flip-TAB laser connection on flex substrate
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1995
Conference Paper
Titel
A new chip packaging method using windowless Flip-TAB laser connection on flex substrate
Author(s)
Azdasht, G.
Zakel, E.
Reichl, H.
Hauptwerk
International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1995. Proceedings
Konferenz
International TAB and Advanced Packaging Symposium (ITAP) 1995
International Flip Chip, Ball Grid Array, TAB, and Advanced Packaging Symposium 1995
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM