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A new chip packaging method using windowless Flip-TAB laser connection on flex substrate

 
: Azdasht, G.; Zakel, E.; Reichl, H.

Semiconductor Technology Center, Inc.:
International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1995. Proceedings : combines the Second International Flip Chip and Ball Grid Array Symposium with the Seventh International TAB and Advanced Packaging Symposium
Neffs, Pa.: Semiconductor Technology Center, 1995
International TAB and Advanced Packaging Symposium (ITAP) <7, 1995, San Jose/Calif.>
International Flip Chip, Ball Grid Array, TAB, and Advanced Packaging Symposium <2, 1995, San Jose/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/PX-26096.html