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Multichip-modules for high frequency applications

: Wolf, J.; Schmückle, S.J.; Owzar, A.; Töpper, M.; Buschick, K.; Reichl, H.

Tielert, R. ; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
Mikroelektronik '97. Vorträge der GMM-Fachtagung
Berlin: VDE-Verlag, 1997 (GMM-Fachbericht 17)
ISBN: 3-8007-2247-X
VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik (Fachtagung) <1997, München>
Fraunhofer IZM ()

Thinfilm multilayer substrate technology with dielectric polymer layers and sputtered/electroplated wiring system provide the highest line density per layer and therefore they are of special interest for MCM applications. A planar integration technology of bare dice embedded in ceramic substrates is used. The components are inserted into premanufactured windows of ceramic substrates and fixed in their position by epoxy. A thinfilm multilayer is realized in a planar fashion on top of the embedded system. The metallization is based on a Ti:W / Cu tie layer, which is subsequently electroplated with Cu. Polyimid Pyralin 2722 (Du Pont) and Cyclotene 4026-46 (Dow Chemical) are used as interlevel dielectric. The paper addresses the microstrip and CPW characteristics. Furthermore, the effect of the meshed ground plane on the line parameters, impedance and attenuation constant are discussed. The dielectric polymer layers are characterized by the effective permittivity and the loss factor.