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Microstrip-to-Microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applications

 

:

Constable, J.H. ; IEEE Components, Packaging, and Manufacturing Technology Society:
3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Proceedings
Piscataway/New Jersey: IEEE, 1998
ISBN: 0-7803-4934-2
ISBN: 0-7803-4935-0
S.101-105
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing <3, 1998, Binghamton/NY>
Englisch
Konferenzbeitrag
Fraunhofer IFAM ()

: http://publica.fraunhofer.de/dokumente/PX-23980.html