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Microstrip-to-Microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applications
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1998
Journal Article
Titel
Microstrip-to-Microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applications
Author(s)
Pohlmann, W.
Jacob, A.F.
Schäfer, H.
Zeitschrift
IEEE transactions on components, packaging and manufacturing technology. B
DOI
10.1109/96.730429
Language
English
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Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM